《微电子制造技术系列丛书：电子组装技术专业英语》按照生产企业电子组装工艺流程介绍了组装元器件、印制电路板、助焊剂、胶黏剂、焊料、清洗剂等材料的基本知识，介绍了电子组装生产线的组成、贴片机的基本结构和作用。简要介绍了焊接技术、清洗技术、检测技术等电子组装各工艺环节的工艺方法，生产过程中的静电防护技术等内容。
本教材适合作为应用型、技能型人才培养的大专院校（高职高专）应用电子类专业教材，也可作为电子组装专业技术培训用书，供从事电子组装工程技术人员参考。
Unit One
1.1 Printed circuit assembly
1.2 Assembly techniques
1.3 SMT design and assembly
1.4 PCB assembly flows
Unit Two SMC and SMD
2.1 Surface mount device definitions
2.2 Sizes of surface mount device
2.3 SMD chip resistors
2.4 SMD ceramic capacitors
2.5 SMD Tantalum capacitors
2.6 SMD MELF
2.7 SMD transistors
2.8 Mounting of Surface Mount component
2.9 Component size comparison
Unit Three Printed circuit boards
3.1 The types of printed circuit board
3.2 PCB design
3.3 PCBs Raw Materials
3.4 Drilling and plating the holes of printed circuit boards
3.5 Creating the printed circuit pattern on the substrate
3.6 Attaching the contact fingers
Unit Four Adhesives
Unit Five Types of solder paste fluxes
5.1 Flux and its requirement
5.2 Inorganic acid fluxes
5.3 Organic acid fluxes
5.4 Rosin
5.5 No-clean fluxes
Unit Six Solder alloys and applications
6.1 Introduction
6.2 Availability and type of solders
Unit Seven Surface Mounted Technology
7.1 Component Placement Machines
7.2 Surface Mounted Technology
7.3 Component pick-up head types
Unit Eight Techniques of solder interconnection
8.1 Soldering iron method
8.2 Hot air reflow soldering method
8.3 Laser reflow soldering method
8.4 Pulse heating method
8.5 IR method
8.6 Vapor phase soldering （VPS）method
8.7 Convection reflow method（air or N2 reflow）
8.8 Combined convection IR method
8.9 Flow /wave soldering method
8.10 The temperature profile concept
8.11 Pb-free soldering process
Unit Nine Clearung
9.1 Water-soluble fluxes
9.2 No-clean fluxes
9.3 Pcb assembly cleaning
9.4 Pcb cleaning test
Unit Ten SMA inspection technique
10.1 Vision system of component placement machines
10.2 Inspection process
10.3 Visual inspection equipment
10.4 Visual inspection items
Unit Eleven Handling and ESD control
11.1Electrostatic discharge
11.2 ESD and EOS
11.3Requirements of static-free work station
附录 A CP-6系列富士贴片机操作简介
Al.1 Machine components and operation panel
Al.2 Starting and Stopping the Machine
附录 B专业词汇
References
（2）Personal items such as plastic cups， thermos bottles， purses， sweaters， and other items of clothing should not be on work benches.
（3）Care should be taken in handling of boards after mounting the e6mponents，and it may be noted that static damage may still result by improper handling of the stuffed boards.
（4）At the soldering area， the operator is required to wear wrist strap well ground-ed through a 1MW. It is better to have a common ground for the test equipment and for the static-free work stations. Even if we provide a separate grounding for static-free workstations， it is highly likely that the ground wires short each other at some point or the other along their length. Therefore， it is recommended， if in doubt9 to check the equipment grounding thoroughly instead of going-in for a separate grounding.
（5）Insulative brushes are used for flux application and cleaning. This may resultin generation of static leading to component damage. Use of cotton is recommendedwhile cleaning or for flux application.
……
书单推荐
